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US Patent Issued to KIOXIA on Aug. 25 for "Semiconductor device with improved write characteristics" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,751, issued on Aug. 25, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device with improved write characteristics" was invented by Ta... और पढ़ें


US Patent Issued to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) on Aug. 25 for "Three dimensional flash memory with bulk erasing" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,752, issued on Aug. 25, was assigned to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (Seoul, South Korea). "Thr... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,753, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and electronic system i... और पढ़ें


US Patent Issued to SK hynix on Aug. 25 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,754, issued on Aug. 25, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and method of manufacturing semicondu... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor memory device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,756, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor memory device and electroni... और पढ़ें


US Patent Issued to Kepler Computing on Aug. 25 for "Method of fabricating a memory device by wafer bonding" (American, Belgian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,757, issued on Aug. 25, was assigned to Kepler Computing Inc. (San Francisco). "Method of fabricating a memory device by wafer bonding" was... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Memory device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,758, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Memory device" was invented by Hyuncheol Kim... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Ferroelectric devices and methods of forming the same" (Belgian Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,759, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Ferroelectric devices and metho... और पढ़ें


US Patent Issued to Intel on Aug. 25 for "Ferroelectric capacitor within backside interconnect" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,760, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Ferroelectric capacitor within backside interconnect" was inven... और पढ़ें


US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Aug. 25 for "Semiconductor storage device and method of manufacturing semiconductor storage device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,761, issued on Aug. 25, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Semiconductor storage device and method of m... और पढ़ें